PERSPECTIVES OF 3D PRINTING / ADDITIVE MANUFACTURING IN PACKAGING

PERSPECTIVES OF 3D PRINTING / ADDITIVE MANUFACTURING IN PACKAGING

Additive manufacturing processes are becoming increasingly important in the production of components. In addition to the opportunities to develop entirely new designs in the consumer-goods market, these technologies are also very promising for manufacturers in the packaging sector and open up a variety of new possibilities – 3D is gaining ground and impacting the development of packaging and also plant engineering where packaging machinery design can be highly customised.

The seminar will provide an overview of the additive manufacturing process, the options for shaping work-pieces and the benefits it brings to the production process, with concrete examples of where 3D printing is already delivering real gains. The session will inspire delegates to explore the use of 3D printing for their own products and processes. This seminar is aimed at packaging designers, research and engineering staff in packaging machine manufacturer as well as R&D specialists in packing businesses.

 

PROGRAM & TOPICS

09:00 – 12:00*

  • 3D Printing – Technologies and Applications (Christiane Fimpel & Philipp Binkert, 3D-MODEL AG)
  • Technology overview
  • Additive manufacturing on an industrial level – a paradigm change?
  • Printing things that won’t be possible
  • Which technology for which application
  • Examples and case studies

12:00 – 13:30: Lunch

13:30 – 16:30*

  • Enhancing Packaging Design Workflow (N.N.-requested)
  • Changes in packaging design processes with 3D printing
  • Use or 3D printing for design examples and mock-ups
  • Printed packages for consumer test
  • Printing machine tools – the alternative for small lot sizes and test productions (Stefan Hässig, Medipack AG)
  • Printing the package vs. milling of mould for plastic processing
  • Product and mould design yesterday and today
  • Workshop 3D printing (Armon Joos, 3D-MODEL AG)
  • From a template to a printed package design
  • Workflow for design studies: Scanning, reverse engineering and printing

* Coffee breaks included every 1 1/2 hours for refreshment, discussion and networking

Details

  • Date: October 22nd 2015 / 9:00 am to 4:30 pm
  • Location: IPI International Packaging Institute, Neustadt 51, CH-8200 Schaffhausen, Switzerland
  • Language: English
  • Fee: CHF 680.-* incl. 8% VAT, lunch and documentation (*or Euro equivalent at actual exchange rate)
  • Registraton: www.ipi.eu/ipi-seminars/registration
Download (PDF, 221KB)

Kommentar verfassen

Deine E-Mail-Adresse wird nicht veröffentlicht. Erforderliche Felder sind mit * markiert

Nach oben scrollen